System and method for a transducer

ABSTRACT

According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.

TECHNICAL FIELD

The present invention relates generally to systems and methods forelectronics, and, in particular embodiments, to a system and method fora transducer.

BACKGROUND

Transducers convert signals from one domain to another and are often anintegral component in sensors. One common sensor including a transducerthat is seen in everyday life is a microphone that converts sound wavesto electrical signals.

Microelectromechanical system (MEMS) based sensors include a family oftransducers produced using micromachining techniques. MEMS, such as aMEMS microphone, gather information from the environment by measuringthe change of physical state in the transducer and transferring atransduced signal to processing electronics that are connected to theMEMS sensor. MEMS devices may be manufactured using micromachiningfabrication techniques similar to those used for integrated circuits.

MEMS devices may be designed to function as, for example, oscillators,resonators, accelerometers, gyroscopes, pressure sensors, microphones,and micro-mirrors. Many MEMS devices use capacitive sensing techniquesfor transducing the physical phenomenon into electrical signals. In suchapplications, the capacitance change in the sensor is converted to avoltage signal using interface circuits.

One such capacitive sensing device is the MEMS microphone. A MEMSmicrophone generally has a deflectable membrane separated by a smalldistance from a rigid backplate. In response to a sound pressure waveincident on the membrane, the membrane deflects towards or away from thebackplate, thereby changing the separation distance between the membraneand backplate. Generally, the membrane and backplate are made out ofconductive materials and form “plates” of a capacitor. Thus, as thedistance separating the membrane and backplate changes in response tothe incident sound wave, the capacitance changes between the “plate” andan electrical signal is generated.

For capacitive MEMS sensors, it is possible, in the presence of a largephysical signal or shock, for one of the deflectable plates to deflectuntil contacting an adjacent plate. In such cases, the voltage appliedto the plates may be sufficient to cause the plates to remain in contactwith one another. This phenomenon may be referred to as “pull-in.” Incapacitive MEMS sensors, pull-in may affect the performance of thesensor.

SUMMARY

According to an embodiment, a transducer system includes a transducingelement and a symmetry detection circuit. The transducing elementincludes a signal plate, a first sensing plate, and a second sensingplate. The symmetry detection circuit is coupled to a differentialoutput of the transducer element and is configured to output an errorsignal based on asymmetry in the differential output.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a system block diagram of an embodiment transducersystem;

FIGS. 2a and 2b illustrate plots of the sensitivity of the embodimenttransducer according to first and second operation scenarios,respectively;

FIG. 3 illustrates a schematic depiction of an embodiment dual backplatetransducer exhibiting the pull-in phenomenon;

FIG. 4 illustrates a differential output waveform of the embodiment dualbackplate transducer exhibiting the pull-in phenomenon before repair;

FIG. 5 illustrates a waveform diagram of the embodiment dual backplatetransducer during operation;

FIG. 6 illustrates a schematic diagram of an embodiment MEMS microphonesystem;

FIGS. 7a, 7b, and 7c illustrate circuit diagrams of embodiment pull-indetection circuits;

FIGS. 8a, 8b, and 8c illustrate circuit diagrams of embodiment pull-inrepair circuits; and

FIG. 9 illustrates a block diagram of an embodiment method of operationfor a transducer system.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of various embodiments are discussed in detailbelow. It should be appreciated, however, that the various embodimentsdescribed herein are applicable in a wide variety of specific contexts.The specific embodiments discussed are merely illustrative of specificways to make and use various embodiments, and should not be construed ina limited scope.

Description is made with respect to various embodiments in a specificcontext, namely microphone transducers, and more particularly, MEMSmicrophones. Some of the various embodiments described herein include,for example, MEMS transducer systems, MEMS microphone systems, dualbackplate MEMS microphones, error detection and repair in transducers,and pull-in detection and repair for capacitive MEMS sensors. In otherembodiments, aspects may also be applied to other applications involvingany type of sensor or transducer according to any fashion as known inthe art.

In a capacitive plate transducer, after pull-in caused by shock or largeamplitude signals, some plates of the capacitive transducer may remainin contact with one another if the plates are biased with a voltageabove the pull-out voltage, where the pull-out voltage is the voltage atwhich the plates will spontaneously separate after pull-in. According tovarious embodiments, in a dual sensing plate capacitive transducer, suchas a dual backplate MEMS microphone, the sensitivity of each plate andthe corresponding differential output is altered by pull-in. Thus,embodiments described herein include a method and circuit to analyze thedifferential output of a dual sensing plate capacitive transducer, suchas a dual backplate MEMS microphone, and identify a pull-in situation.In various embodiments, a repair circuit controls the charge on theaffected plates, when pull-in is detected by a pull-in detectioncircuit, in order to cause the plates exhibiting pull-in to release andthe transducer to be returned to an unaffected operating condition. Insome embodiments, the dual backplate MEMS microphone is operated with abias voltage between membrane and both backplates that is above thepull-out voltage. In such embodiments, the dual backplate MEMSmicrophone is biased with a higher bias voltage, leading to an increasedsensitivity, and is repaired by the repair circuit in the case ofpull-in.

FIG. 1 illustrates a system block diagram of an embodiment transducersystem 100 including dual backplate MEMS microphone 102, amplifier 104,pull-in detection circuit 106, repair circuit 108, and bias circuit 110.According to various embodiments, MEMS microphone 102 receives anacoustic signal A_in from a sensing environment, such as through a soundport to an ambient environment, and transduces the acoustic signal tosupply a differential electrical signal to amplifier 104, which outputsan amplified differential output signal E_out.

In various embodiments, pull-in detection circuit 106 monitorsdifferential output signal E_out during operation of transducer system100 and supplies release enable signal R_en to repair circuit 108 whenpull-in is detected. In some embodiments, pull-in detection circuit 106may monitor the input of amplifier 104 instead of or in addition todifferential output signal E_out. Various specific embodiment pull-indetection circuits and repair circuits are described further hereinbelow. Repair circuit 108 triggers a release or repair sequence that maysupply disconnect repair signal R_dis to MEMS microphone 102 in order todisconnect the microphone plates or may supply bias repair signal R_biasto bias circuit 110 in order to alter the bias voltage applied to atleast one of the plates of MEMS microphone 102. In various embodiments,the bias voltage V_bias applied to MEMS microphone 102 is above pull-outvoltage VP_out during normal operation and below pull-out voltage VP_outduring a release or repair sequence.

In various embodiments, other types of differential capacitive platetransducers or sensors may be used in place of MEMS microphone 102, as adual backplate MEMS microphone is only one example embodiment. Forexample, some embodiments may include a dual plate accelerometer withpull-in detection circuit 106 and repair circuit 108, as describedherein. In another embodiment, a differential output capacitive pressuresensor may include pull-in detection circuit 106 and repair circuit 108,as described herein.

FIGS. 2a and 2b illustrate plots of the sensitivity of the embodimenttransducer according to first and second operation scenarios,respectively. The plots depict the sensitivity of the transducer, asshown on the vertical axis, versus the transducer voltage V_mic appliedto the transducer plates, as shown on the horizontal axis. The voltagesshown include pull-in voltage VP_in and pull-out voltage VP_out.According to various embodiments, FIG. 2a illustrates a firstcharacterization scenario for identifying a first operating point OP1,as set by bias voltage V_bias, which is set below pull-out voltageVP_out.

The sensitivity plots illustrated in FIGS. 2a and 2b are generated inorder to characterize the transducer behavior with respect to pull-inand pull out behavior. In order to perform this characterization, asmall acoustic signal is applied to the acoustic transducer that causesa small variation in the total displacement distance between thebackplate and membrane. The small variation is much less than the totaldisplacement distance. The transducer voltage V_mic is varied and thesensitivity is measured for each voltage. Based on the resulting plotfrom the first characterization illustrated in FIG. 2a , a firstoperating point OP1 is determined. First operating point OP1 mayguarantee that the membrane will not stick to the backplate following anacoustic shock event. If bias voltage V_bias is set to operate thetransducer at first operating point OP1 (below pull out voltage VP_out),although a large acoustic signal may bring the membrane and thebackplate in contact, once the large acoustic signal disappears, themembrane returns to its original position.

In various embodiments, as shown in FIGS. 2a and 2b , the sensitivityincreases proportionally to the voltage applied to the transducer untilpull-in occurs when plates of the transducer make contact with oneanother. When pull-in occurs, the plates stick together and sensitivityof the transducer decreases substantially because the membrane is nolonger free to move. Additionally, the backplate being in contact withthe membrane will generate a larger signal compared to the otherbackplate not in contact with the membrane because of a largercapacitance issuing from the smaller separation distance. As shown inFIG. 2a , because bias voltage V_bias is set below pull-out voltageVP_out, the sticking plates separate and the operation returns to firstoperating point OP1 following a shock. In such embodiments, thesensitivity of the transducer is the same before and after pull-inoccurs because the transducer is operated at first operating point OP1both before and after pull-in.

FIG. 2b illustrates a second characterization scenario including secondand third operating points OP2 and OP3 set by bias voltage V_bias thatis above pull-out voltage VP_out. If the transducer is operated atsecond operating point OP2 by being biased with a larger voltage, i.e.,bias voltage V_bias is above pull out, the membrane may remain incontact with the backplate after an acoustic shock event. In such acase, the operating point shifts from second operating point OP2 tothird operating point OP3, which results in decreased sensitivity, asshown. As before, following the shock or large amplitude signal, thevoltage applied to the plates of the transducer returns to bias voltageV_bias. Because bias voltage V_bias is set above pull-out voltageVP_out, the sticking plates do not separate and the operation moves tothird operating point OP3 after the voltage applied to the plates of thetransducer returns to bias voltage V_bias. Thus, the sensitivity of thetransducer at second operating point OP2, before pull-in occurs, isgreater than the sensitivity of the transducer at third operating pointOP3, after pull-in occurs, because the transducer is biased abovepull-out voltage VP_out and the sticking plates remain in contact.Generally, the first operating point OP1 is chosen with a safety marginsuch that bias voltage V_bias is somewhat below pull out voltage VP_outin order to prevent operating at third operating point OP3. In variousembodiments, by setting biasing voltage V_bias above pull out voltageVP_out, the MEMS transducer generates larger signals with increasedsensitivity when operating at operating point OP2. In some embodiments,the signal to noise ratio is increased. For example, the SNR may beincreased by up to 8 dB in the embodiment shown FIG. 2. According tovarious embodiments, described further herein, capacitive platetransducers are biased above the pull-out voltage as shown in FIG. 2band embodiment detection and repair circuits are configured to detectpull-in and repair the transducer by releasing sticking plates in orderto return to the initial operating point, such as second operating pointOP2.

FIG. 3 illustrates a schematic depiction of an embodiment dual backplatetransducer 120 exhibiting the pull-in phenomenon. Dual backplatetransducer 120 includes top backplate 122, bottom backplate 124, andmembrane 126. In various embodiments, top backplate 122 is coupled to afirst output terminal and exhibits voltage V+, bottom backplate 124 iscoupled to a second output terminal and exhibits voltage V−, andmembrane 126 is coupled to a bias voltage source, such as bias circuit110, and is provided with bias voltage V_bias. The upper depiction ofdual backplate transducer 120 illustrates membrane 126 in anun-deflected state when membrane 126 does not exhibit the pull-inphenomenon. The lower depiction of dual backplate transducer 120illustrates membrane 126 in a deflected state when membrane 126 issticking to top backplate 122 and exhibiting the pull-in phenomenon.

According to various embodiments, in the case where membrane 126 is notsticking, the sensitivity present between membrane 126 and top backplate122 may be equal to the sensitivity present between membrane 126 andbottom backplate 124 and is at a normal or typical sensitivity level. Inthe case where membrane 126 is sticking to top backplate 122, thesensitivity present between membrane 126 and top backplate 122 may be ata higher sensitivity level and the sensitivity present between membrane126 and bottom backplate 124 and is at a lower sensitivity level. Thus,during pull-in, the differential output signal on the first and secondoutput terminals coupled to top backplate 122 and bottom backplate 124,respectively, may be asymmetric because the sensitivity seen at eachoutput is altered inversely during pull-in.

FIG. 4 illustrates a differential output waveform of the embodiment dualbackplate transducer 120 exhibiting the pull-in phenomenon beforerepair. In various embodiments, voltage V+ on the first output terminaland V− on the second output terminal are plotted during normal soundpressure level (SPL) input period 130, during shock period 132, andduring normal SPL input period 134 following shock when pull-in hasoccurred. As shown, voltages V+ and V− are symmetric during normal SPLperiod 130 before shock. Shock period 132 causes pull-in to occur asdescribed in reference to FIG. 3 above. Following the shock, voltages V+and V− are asymmetric during normal SPL period 134 due to the pull-inphenomenon asymmetrically altering the capacitance and signal magnitudeseen at the first and second output terminals of dual backplatetransducer 120. During normal SPL period 134 following pull-in, thesignals generated by the sticking plates may be larger than beforepull-in as shown during period 130 because the sticking plates have anincreased capacitance due to the smaller separation distance between theplates.

In various embodiments, the differential signal including voltages V+and V− on the first and second output terminals is monitored in order todetect this asymmetric behavior resulting from pull-in. A pull-indetection circuit, such as pull-in detection circuit 106, monitors andidentifies the asymmetric variation in the differential output signaland generates a repair or release signal as described above in referenceto FIG. 1 and described further herein below.

FIG. 5 illustrates a waveform diagram of the embodiment dual backplatetransducer during operation including common mode signal CM and releasesignal R_en. According to various embodiments, common mode signal CM isgenerated by monitoring the differential output of a transducer, such asthe differential signal including voltages V+ and V− as shown in FIGS. 3and 4, and determining asymmetric features of the differential outputsignal. For example, during normal SPL period 130 shown in FIG. 4,common mode signal CM is a constant value, such as zero for example, ora very small signal compared to the single ended signals V+ and V− orthe difference between V+ and V− because the voltages V+ and V− arefully symmetric. In some embodiments, common mode signal CM may be 1/10or 1/100 of the single ended voltage signals V+ and V−, or thedifference, when voltages V+ and V− are symmetric. In furtherembodiments, common mode signal CM may be even smaller than 1/100.During normal SPL period 134 after pull-in occurs, the voltages V+ andV− are asymmetric and the resulting common mode signal CM is notconstant, but varies in relation to the asymmetric difference betweenthe voltages. In such embodiments, common mode signal CM is no longer1/10 or 1/100 of the single ended signals V+ and V−, but instead may be½ of the single ended signals V+ and V−, for example. In one embodiment,common mode signal CM is generated according to the equalCM=((V+)−(V−))÷2. In the various embodiments, voltages V+ or V− mayrefer to either the unamplified transduced electrical signals outputfrom the transducer or the amplified transduced electrical signalsoutput from the transducer. In other embodiments, common mode signal CMmay be generated according to other equations.

In various embodiments, release signal R_en is generated by comparingcommon mode signal CM to a threshold, such as comparison voltage V_comp.When common mode signal CM exceeds comparison voltage V_comp, releasesignal R_en is activated as shown in FIG. 5. Release signal R_en maytrigger a release or repair sequence that causes the transducer platesto stop sticking. In some embodiments, release signal R_en is triggeredbased on an absolute value comparison between comparison voltage V_compand common mode signal CM. Release signal R_en may be filtered in orderto prevent spurious triggering of the repair sequence.

FIG. 6 illustrates a schematic diagram of an embodiment MEMS microphonesystem including dual backplate MEMS microphone 202 and applicationspecific integrated circuit (ASIC) 203. According to variousembodiments, MEMS microphone 202 receives acoustic signals through asound port (not shown). The acoustic signals cause deflectable membrane226 to deflect, altering the parallel plate capacitances betweenmembrane 226 and rigid top backplate 222 and between membrane 226 andrigid bottom backplate 224. The change in capacitance produces adifferential signal including voltages V+ and V− on signal lines 228 and230, which are coupled to ASIC 203. In some embodiments, membrane 226receives a bias voltage on bias line 232 from charge bump 210 in ASIC203. The differential signal including voltages V+ and V− may besymmetric, or approximately symmetric, under some operating conditions.Similarly, signal lines 228 and 230 may receive a DC voltage offset fromoffset voltage source 214, which is coupled to signal lines 228 and 230through impedance elements 216 and 218, respectively. Bias voltageV_bias may be applied between membrane 226 and top and bottom backplates222 and 224 by the combination of charge pump 210 and offset voltagesource 214.

According to various embodiments, the differential signal includingvoltages V+ and V− is supplied to amplifiers 204 a and 204 b in ASIC203, which outputs an amplified differential signal including voltagesAV+ and AV−. The amplified differential signal including voltages AV+and AV− may be output to a further processor (not shown), such as anaudio processor, or any other functional block in various embodiments.

In various embodiments, common mode measurement circuit 206 monitors theamplified differential signal including voltages AV+ and AV− andgenerates common mode signal CM, as described in reference to FIG. 5.Common mode signal CM is compared to comparison voltage V_comp bycomparator 212. Release circuit 208 receives release enable signal R_enfrom comparator 212 and controls bias voltage V_bias through bias repairsignal R_bias based on release enable signal R_en. Release circuit 208and common mode measurement circuit 206 may each be implementedaccording to a number of difference embodiments, as described below inreference to FIGS. 7a -8 c.

In some embodiments, MEMS microphone 202 may be implemented with twodeflectable membranes and a single rigid backplate set between themembranes. In such embodiments, the differential output signal may begenerated from connections to the membranes. According to variousembodiments, MEMS microphone 202 and the ASIC 203 are implemented on asame wafer or same semiconductor die. In other embodiments, MEMSmicrophone 202 and the ASIC 203 are implemented on two separatesemiconductor dies. In such embodiments, microphone 202 and amplifiers204 a and 204 b may be formed on a first semiconductor die while theother components of ASIC 203, excluding amplifiers 204 a and 204 b, maybe implemented on a second semiconductor die. The fabrication of thesemiconductor die, either as two separate semiconductor dies or a singleintegrated product, may be performed according to any fabricationmethods known in the art. MEMS microphone 202 and the ASIC 203 may bothbe fabricated using the same fabrication technology or may be fabricatedusing separate fabrication technology.

FIGS. 7a, 7b, and 7c illustrate circuit diagrams of embodiment pull-indetection circuits 106 or common mode measurement circuit 206. Accordingto one embodiment, FIG. 7a illustrates pull-in detection circuits 106 orcommon mode measurement circuit 206 including a resistive divider ofresistors R1 and R2 coupled between the outputs of amplifiers 204 a and204 b, which output the amplified differential signal including AV+ andAV−. In such embodiments, common mode signal CM is output from themiddle node of the resistive divider of resistors R1 and R2.

According to another embodiment, FIG. 7b illustrates pull-in detectioncircuits 106 or common mode measurement circuit 206 including theresistive divider of resistors R1 and R2 coupled between the outputs ofamplifiers 204 a and 204 b, as in FIG. 7a , but with the addition ofoutput capacitor C1. In such embodiments, common mode signal CM isoutput from the middle node of the resistive divider of resistors R1 andR2 through capacitor C1.

According to another embodiment, FIG. 7c illustrates pull-in detectioncircuits 106 or common mode measurement circuit 206 including theresistive divider of resistors R1 and R2 coupled between the outputs ofamplifiers 204 a and 204 b and with the addition of output capacitor C1,but also including logarithmic amplifiers and adder circuits. In suchembodiments, common mode measurement circuit 206 operates as a symmetrydetection circuit for comparing the output voltages AV+ and AV− in orderto detect an asymmetry error.

According to some embodiments, performing symmetry detection may includedetermining a ratio of the difference between output voltages AV+ andAV− and common mode signal CM. FIG. 7c illustrates one embodimentimplementation of using this ratio for symmetry detection. In FIG. 7ccommon mode signal CM is output from the middle node of the resistivedivider of resistors R1 and R2 through capacitor C1, as shown in FIG. 7b, before being supplied to logarithmic amplifier 238. The differencebetween amplified output voltages AV+ and AV− is calculated in adder 234and supplied to logarithmic amplifier 236. The difference of the outputsof logarithmic amplifier 236 and logarithmic amplifier 238 is calculatedin adder 240 and supplied as the sensing voltage output V_sense.According to one embodiment, sensing voltage output V_sense is given bythe logarithmic equationV_sense=log((AV+)−(AV−))−log(CM).In other embodiments, sensing voltage output V_sense is proportional tothe logarithmic equation. In further embodiments, sensing voltage outputV_sense is approximated by the logarithmic equation. In suchembodiments, the logarithmic functions may implement the ratio of theoutput difference and the common mode signal. In some embodiments, anexponential function may be applied to remove the logarithmic functionand obtain the true ratio. The sensing voltage output V_sense may becoupled to release circuit 208 or to comparator 212 in variousembodiments.

In further embodiments, multiple comparators may be used in ASIC 203 tocompare common mode signal CM to positive and negative thresholds andidentify which backplate 222,224 is in contact with membrane 226 duringpull-in. Alternatively, other approaches may be used to identify whichbackplate 222,224 is in contact with membrane 226. In various otherembodiments, the elements of FIGS. 7a, 7b, and 7c may be recombined indifferent combinations and with other components by one of ordinaryskill in the art. It is envisioned that all such variations are includedwithin the scope of this disclosure.

FIGS. 8a, 8b, and 8c illustrate circuit diagrams of embodiment pull-inrepair circuits 108 or release circuit 208. According to one embodiment,FIG. 8a illustrates repair circuit 108 or release circuit 208implemented as a reset circuit including switches 242 a, 242 b, and 242c coupled between membrane 226 and ground, backplate 224 and ground, andbackplate 222 and ground, respectively, and controlled by release enablesignal R_en. When asymmetric behavior is detected between voltages AV+and AV− by the common mode measurement circuit 206 or pull-in detectioncircuit 106, as described above, release enable signal R_en is activatedto close any of or all of switches 242 a, 242 b, and 242 c. Whenswitches 242 a, 242 b, and 242 c are closed, they provide a conductionpath to ground terminals, as shown, and discharge the charge stored onmembrane 226, backplate 222, and backplate 224. Discharging membrane226, backplate 222, and backplate 224 lowers the voltage between themembrane and either plate below pull-out voltage VP_out and causes thesticking plates to separate. In other embodiments, the ground terminalsmay be replaced with another reference supply voltage.

According to another embodiment, FIG. 8b illustrates repair circuit 108or release circuit 208 implemented as a charge correction or chargebalancing circuit including switches 244, 246, 248, and 250 as well ascapacitors C2 and C3. Each of switches 244, 246, 248, and 250 mayreceive a control signal based on release enable signal R_en. Whenrelease enable signal R_en is activated, some or all of switches 244,246, 248, and 250 are closed in order to form a conduction path throughcapacitor C2 or C3 that conducts between membrane 226 and eitherbackplate 222 or backplate 224. As similarly described above inreference to FIG. 8a , conducting charge between the either backplate222,224 and membrane 226 lowers the voltage between the membrane andeither plate below pull-out voltage VP_out and causes the stickingplates to separate. Thus, the combination of switches 244, 246, 248, and250 and capacitors C2 and C3 is able to balance or correct the charge onthe plates in order to repair the sticking plates back to a normaloperating point that exhibits symmetric output signals and equalsensitivity.

According to another embodiment, FIG. 8c illustrates repair circuit 108or release circuit 208 implemented as a disconnect circuit includingswitches 252 and 254 coupled between top backplate 222 and amplifier 204a and between bottom backplate 224 and amplifier 204 b. Switches 252 and254 are controlled based on release enable signal R_en. In variousembodiments, when release enable signal R_en is activated, correspondingto a detected pull-in or asymmetry in the differential output signal,switches 252 or 254 are opened in order to disconnect top backplate 222or bottom backplate 224 from amplifiers 204 a or 204 b and any offsetvoltages (not shown, see FIG. 6, for example). When top and bottombackplates 222 and 224 are disconnected from amplifier 204 a and 204 b,the charge on the sticking plate leaks off causing the voltage betweenplates to decrease below the pull-out voltage. Thus, when switches 252or 254 are opened for a certain period of time, the sticking platesseparate and the dual backplate MEMS microphone returns to a normaloperating point that exhibits symmetric output signals and equalsensitivity. According to various embodiments, elements of FIGS. 8a, 8b, and 8 c may be interchanged and replaced. Such modifications areenvisioned within the scope of this disclosure.

FIG. 9 illustrates a block diagram of an embodiment method of operation300 for a transducer system including steps 302, 304, 306, and 308.According to various embodiments, step 302 includes generating adifferential output signal at a differential capacitive transducer basedon a sensed input signal. The differential capacitive transducer may bea dual backplate MEMS microphone and the sensed input signal may be anacoustic signal, for example. In other embodiments, the differentialcapacitive transducer may have two deflectable membranes and a singlerigid backplate. The differential output signal is a differentialelectrical signal. In some embodiments the differential output signal isamplified during the generating in step 302.

In various embodiments, step 304 includes generating a symmetry signalbased on the differential output signal. As described further hereinabove, the symmetry signal may be generated at a common mode measurementcircuit or a symmetry detection circuit. In various embodiments, thesymmetry signal may include the common mode signal or other featuresrelated to symmetry. Step 306 includes comparing the symmetry signal toan error condition characteristic. The error condition characteristicmay be referred to as an alarm level or simply a comparison voltageV_comp, as described above in reference to FIG. 6. In some embodiments,the error condition characteristic may correspond to a specific level ofasymmetry in the differential output signal. In a specific embodiment,the error condition characteristic is set to identify pull-in ofcapacitive plates in the differential capacitive transducer. In someembodiments, comparing the symmetry signal may include multiplecomparisons to determine polarity of the asymmetry in order to identifywhich plates are exhibiting pull-in.

According to various embodiments, step 308 includes repairing thedifferential capacitive transducer if the comparing indicates an errorcondition. As determined in step 306, an error condition may correspondto pull-in of the capacitive plates. Repairing the differentialcapacitive transducer may include steps to redistribute or reset thecharge on the capacitive plates in some embodiments. In otherembodiments, repairing the differential capacitive transducer mayinclude disconnecting the capacitive plates from bias sources until thecharge on the capacitive plates is lowered. Repairing the differentialcapacitive transducer may include initiating a release protocol toseparate sticking plates by lowering the charge on the sticking plates.In various embodiments, when the charge is lowered, the voltage acrosssticking plates decreases below the pull-out voltage and the stickingplates separate.

According to an embodiment, a transducer system includes a transducingelement and a symmetry detection circuit coupled to a differentialoutput of the transducer element. The transducing element includes asignal plate, a first sensing plate, and a second sensing plate. Thesymmetry detection circuit is configured to output an error signal basedon asymmetry in the differential output.

In various embodiments, the signal plate is a membrane, the firstsensing plate is a first backplate, and the second sensing plate is asecond backplate. In other embodiments, the signal plate is a backplate,the first sensing plate is a first membrane, and the second sensingplate is a second membrane. The first sensing plate and the secondsensing plate may be formed adjacent to the signal plate on oppositesides and are each spaced a first distance from the signal plate.

In various embodiments, the symmetry detection circuit includes aresistive divider connected between positive and negative outputterminals supplying the differential output. The symmetry detectioncircuit may also include a filter coupled to the resistive divider. Thesymmetry detection circuit may still further include a first addercoupled to the positive and negative output terminals, a firstlogarithmic amplifier coupled to the filter, a second logarithmicamplifier coupled to an output of the first adder and configured toreceive a first difference, and a second adder coupled to the firstlogarithmic amplifier and the second logarithmic amplifier. In suchembodiments, the first adder is configured to calculate the firstdifference from signals on the positive and negative output terminalsand the second adder is configured to calculate a second difference fromoutputs of the first logarithmic amplifier and the second logarithmicamplifier.

In various embodiments, the transducer system further includes a repaircircuit coupled to the transducer element and the symmetry detectioncircuit. The repair circuit may be configured to alter a charge level onthe signal plate, the first sensing plate, or the second sensing platebased on the error signal. In some embodiments, the repair circuitincludes a first reset switch coupled between the signal plate and a lowreference supply, a second reset switch coupled between the firstsensing plate and the low reference supply, and a third reset switchcoupled between the second sensing plate and the low reference supply.The first, second, and third reset switches may be controlled based onthe error signal. In some embodiments, the repair circuit includes afirst charge distribution unit having a first terminal coupled to thesignal plate and a second terminal coupled to the first sensing plateand a second charge distribution unit having a first terminal coupled tothe signal plate and a second terminal coupled to the second sensingplate. The first charge distribution unit is configured to receive theerror signal and the second charge distribution unit is configured toreceive the error signal. In such embodiments, the first chargedistribution unit and the second charge distribution unit each include afirst switch, a capacitor, and a second switch coupled in series betweenthe first terminal and the second terminal of the respective chargedistribution unit. The first switch and second switch in both the firstcharge distribution unit and the second charge distribution unit may beswitched based on the error signal. In some embodiments, the repaircircuit includes a first disconnect switch coupled between the firstsensing plate and additional processing circuits and a second disconnectswitch coupled between the second sensing plate and the additionalprocessing circuits. The first disconnect switch and the seconddisconnect switch are controlled based on the error signal.

In various embodiments, the transducer system includes a bias circuitcoupled to the signal plate, a first amplifier coupled between the firstsensing plate and a first terminal of the differential output, and asecond amplifier coupled between the second sensing plate and a secondterminal of the differential output. In some embodiments, the transducerelement, the first amplifier, and the second amplifier are disposed on asame integrated circuit.

According to an embodiment, a method of operating a transducer systemincludes generating a differential output signal at a differentialcapacitive transducer based on a sensed input signal, generating asymmetry signal based on the differential output signal, comparing thesymmetry signal to an error condition characteristic, and repairing thedifferential capacitive transducer if the comparing indicates an errorcondition.

In various embodiments, repairing the differential capacitive transducerincludes coupling a capacitive plate of the differential capacitivetransducer to a ground connection. In some embodiments, repairing thedifferential capacitive transducer includes adjusting a voltage on acapacitive plate of the differential capacitive transducer below apull-out voltage. In further embodiments, repairing the differentialcapacitive transducer includes disconnecting a capacitive plate of thedifferential capacitive transducer from an output circuit.

In various embodiments, generating the symmetry signal includesgenerating a common mode signal based on the differential output signal.In such embodiments, the method may also include filtering the commonmode signal. In some embodiments, generating the symmetry signalincludes generating a difference signal between a first component and asecond component of the differential output signal, generating a commonmode signal based on the differential output signal, and determining aratio of the difference signal to the common mode signal. In a specificembodiment, the symmetry signal is proportional to the logarithmicequation log(D1−D2)−log(CM), where D1 is the first component of thedifferential output signal, D2 is the second component of thedifferential output signal, and CM is the common mode signal.

According to an embodiment, a microphone system includes a dualbackplate MEMS microphone and an interface circuit. The dual backplateMEMS microphone includes a first backplate, a second backplate, amembrane formed between the first backplate and the second backplate, afirst output terminal coupled to the first backplate, and a secondoutput terminal coupled to the second backplate. The interface circuitincludes a first amplifier coupled to the first output terminal, asecond amplifier coupled to the second output terminal, a symmetrydetection circuit coupled to outputs of the first amplifier and thesecond amplifier and including a symmetry signal terminal, a comparatorcoupled to the symmetry signal terminal and an asymmetry threshold inputand including a release enable output, and a release circuit coupled tothe release enable output and the membrane. The release circuit isconfigured to provide a release control signal to the membrane based onsignals received from the release enable output.

In various embodiments, the symmetry detection circuit includes aresistive divider coupled between outputs of the first amplifier and thesecond amplifier, and a capacitor coupled to an intermediate node of theresistive divider. In some embodiments, the symmetry detection circuitincludes a first adder coupled to the outputs of the first amplifier andthe second amplifier, a first logarithmic amplifier coupled to thecapacitor, a second logarithmic amplifier coupled to an output of thefirst adder and configured to receive a first difference, and a secondadder coupled to the first logarithmic amplifier and the secondlogarithmic amplifier. The first adder is configured to calculate thefirst difference from signals on the outputs of the first amplifier andthe second amplifier and the second adder is configured to calculate asecond difference from outputs of the first logarithmic amplifier andthe second logarithmic amplifier.

In various embodiments, the release circuit includes a plurality ofswitches controlled based on the signals received from the releaseenable output. In such embodiments, each switch is coupled to the firstbackplate, the second backplate, or the membrane and the switches areconfigured to adjust a charge level on the first backplate, the secondbackplate, or the membrane. In some embodiments, the first backplate,the second backplate, the membrane, the first amplifier, and the secondamplifier are disposed on a same integrated circuit.

According to an embodiment, advantages may include operatingdifferential capacitive transducers with a higher sensitivity, simpledetection of error conditions in differential capacitive transducers,and simple repair of error conditions in differential capacitivetransducers.

While this invention has been described with reference to illustrativeembodiments, this description is not intended to be construed in alimiting sense. Various modifications and combinations of theillustrative embodiments, as well as other embodiments of the invention,will be apparent to persons skilled in the art upon reference to thedescription. It is therefore intended that the appended claims encompassany such modifications or embodiments.

What is claimed is:
 1. A transducer system comprising: a transducerelement comprising a signal plate, a first sensing plate, and a secondsensing plate; and a symmetry detection circuit coupled to adifferential output of the transducer element, the symmetry detectioncircuit configured to determine a common mode component of thedifferential output, generate a first difference signal between a firstcomponent and a second component of the differential output, determine aratio of the first difference signal to the common mode component,produce an error signal based on the determined ratio and activate arepair circuit configured to repair a pull-in condition of thetransducer element when the error signal exceeds a predetermined value.2. The transducer system of claim 1, wherein: the signal plate is amembrane, the first sensing plate is a first backplate, and the secondsensing plate is a second backplate.
 3. The transducer system of claim1, wherein: the signal plate is a backplate, the first sensing plate isa first membrane, and the second sensing plate is a second membrane. 4.The transducer system of claim 1, wherein the first sensing plate andthe second sensing plate are formed adjacent to the signal plate onopposite sides and are each spaced a first distance from the signalplate.
 5. The transducer system of claim 1, wherein the symmetrydetection circuit comprises a resistive divider connected betweenpositive and negative output terminals supplying the differentialoutput.
 6. The transducer system of claim 5, wherein the symmetrydetection circuit further comprises a filter coupled to the resistivedivider.
 7. The transducer system of claim 6, wherein the symmetrydetection circuit further comprises: a first adder coupled to thepositive and negative output terminals, the first adder configured tocalculate the first difference signal from signals on the positive andnegative output terminals; a first logarithmic amplifier coupled to thefilter; a second logarithmic amplifier coupled to an output of the firstadder and configured to receive the first difference signal; and asecond adder coupled to the first logarithmic amplifier and the secondlogarithmic amplifier, the second adder configured to calculate a seconddifference signal from outputs of the first logarithmic amplifier andthe second logarithmic amplifier.
 8. The transducer system of claim 1,further comprising the repair circuit coupled to the transducer elementand the symmetry detection circuit, the repair circuit configured toalter a charge level on the signal plate, the first sensing plate, orthe second sensing plate based on the error signal, wherein the alteredcharge level is configured to repair the pull-in condition of thetransducer element.
 9. The transducer system of claim 8, wherein therepair circuit comprises: a first reset switch coupled between thesignal plate and a low reference supply; a second reset switch coupledbetween the first sensing plate and the low reference supply; and athird reset switch coupled between the second sensing plate and the lowreference supply, wherein the first, second, and third reset switchesare controlled based on the error signal.
 10. The transducer system ofclaim 8, wherein the repair circuit comprises: a first chargedistribution unit having a first terminal coupled to the signal plateand a second terminal coupled to the first sensing plate, wherein thefirst charge distribution unit is configured to receive the errorsignal; and a second charge distribution unit having a first terminalcoupled to the signal plate and a second terminal coupled to the secondsensing plate, wherein the second charge distribution unit is configuredto receive the error signal.
 11. The transducer system of claim 10,wherein the first charge distribution unit and the second chargedistribution unit each comprise a first switch, a capacitor, and asecond switch coupled in series between the first terminal and thesecond terminal of the respective charge distribution unit, and whereinthe first switch and second switch in both the first charge distributionunit and the second charge distribution unit are switched based on theerror signal.
 12. The transducer system of claim 8, wherein the repaircircuit comprises: a first disconnect switch coupled between the firstsensing plate and additional processing circuits; and a seconddisconnect switch coupled between the second sensing plate and theadditional processing circuits, wherein the first disconnect switch andthe second disconnect switch are controlled based on the error signal.13. The transducer system of claim 1, further comprising: a bias circuitcoupled to the signal plate; a first amplifier coupled between the firstsensing plate and a first terminal of the differential output; and asecond amplifier coupled between the second sensing plate and a secondterminal of the differential output.
 14. The transducer system of claim13, wherein the transducer element, the first amplifier, and the secondamplifier are disposed on a same integrated circuit.
 15. A method ofoperating a transducer system, the method comprising: generating adifferential output signal at a differential capacitive transducer basedon a sensed input signal; determining a common mode signal of thedifferential output signal; generating a symmetry signal based on thedetermined common mode signal, generating the symmetry signal comprisinggenerating a difference signal between a first component and a secondcomponent of the differential output signal, and determining a ratio ofthe difference signal to the common mode signal; comparing the symmetrysignal to an error condition characteristic; and repairing a pull-incondition of the differential capacitive transducer if the comparingindicates an error condition.
 16. The method of claim 15, whereinrepairing the differential capacitive transducer comprises coupling acapacitive plate of the differential capacitive transducer to a groundconnection.
 17. The method of claim 15, wherein repairing thedifferential capacitive transducer comprises adjusting a voltage on acapacitive plate of the differential capacitive transducer below apull-out voltage.
 18. The method of claim 15, wherein repairing thedifferential capacitive transducer comprises disconnecting a capacitiveplate of the differential capacitive transducer from an output circuit.19. The method of claim 15, further comprising filtering the common modesignal.
 20. The method of claim 15, wherein the symmetry signal isproportional to a logarithmic equation:log(D1−D2)−log(CM), wherein D1 is the first component of thedifferential output signal, D2 is the second component of thedifferential output signal, and CM is the common mode signal.
 21. Amicrophone system comprising: a dual backplate MEMS(microelectromechanical system) microphone comprising: a firstbackplate, a second backplate, a membrane formed between the firstbackplate and the second backplate, a first output terminal coupled tothe first backplate, and a second output terminal coupled to the secondbackplate; and an interface circuit comprising: a first amplifiercoupled to the first output terminal, a second amplifier coupled to thesecond output terminal, a symmetry detection circuit coupled to outputsof the first amplifier and the second amplifier, the symmetry detectioncircuit configured to determine a common mode component of a signal ofthe first output terminal and a signal of the second output terminal andproduce a signal symmetry signal at a symmetry signal terminal based onthe determined common mode component, wherein the symmetry detectioncircuit comprises a resistive divider coupled between outputs of thefirst amplifier and the second amplifier, and a capacitor coupled to anintermediate node of the resistive divider, a comparator coupled to thesymmetry signal terminal and an asymmetry threshold input and comprisinga release enable output, and a release circuit coupled to the releaseenable output, and to the first backplate, or the second backplate, therelease circuit configured to repair a pull-in condition of MEMSmicrophone by providing a release control signal to the first backplateor the second backplate based on signals received from the releaseenable output.
 22. The microphone system of claim 21, wherein thesymmetry detection circuit further comprises: a first adder coupled tothe outputs of the first amplifier and the second amplifier, the firstadder configured to calculate a first difference from signals on theoutputs of the first amplifier and the second amplifier; a firstlogarithmic amplifier coupled to the capacitor; a second logarithmicamplifier coupled to an output of the first adder and configured toreceive the first difference; and a second adder coupled to the firstlogarithmic amplifier and the second logarithmic amplifier, the secondadder configured to calculate a second difference from outputs of thefirst logarithmic amplifier and the second logarithmic amplifier. 23.The microphone system of claim 21, wherein the release circuit comprisesa plurality of switches controlled based on the signals received fromthe release enable output, each switch coupled to the first backplate orthe second backplate, and wherein the switches are configured to adjusta charge level on the first backplate, the second backplate, or themembrane.
 24. The microphone system of claim 21, wherein the firstbackplate, the second backplate, the membrane, the first amplifier, andthe second amplifier are disposed on a same integrated circuit.
 25. Themicrophone system of claim 21, further comprising a further comparatorcoupled to the symmetry signal terminal and a further asymmetrythreshold input.
 26. A system comprising: a transducer elementcomprising a signal plate, a first sensing plate, and a second sensingplate; and a symmetry detection circuit coupled to a coupled to adifferential output of the transducer element, the symmetry detectioncircuit configured to output an error signal based on asymmetry in thedifferential output, wherein the symmetry detection circuit comprises aresistive divider connected between positive and negative outputterminals supplying the differential output, a filter coupled to theresistive divider, a first adder coupled to the positive and negativeoutput terminals, the first adder configured to calculate a firstdifference from signals on the positive and negative output terminals; afirst logarithmic amplifier coupled to the filter, a second logarithmicamplifier coupled to an output of the first adder and configured toreceive the first difference, and a second adder coupled to the firstlogarithmic amplifier and the second logarithmic amplifier, the secondadder configured to calculate a second difference from outputs of thefirst logarithmic amplifier and the second logarithmic amplifier.